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ZHENGKAIIndustrial Equipment
ZK-R2R-BG-1300 roll-to-roll UV exposure equipment

PCB & SMT

Equipment for PCB UV drying, exposure, nitrogen baking and FPC post-process handling.

Find Equipment for Your Process

Browse 6 products associated with PCB & SMT. Filter by equipment category, then open a product to review its configuration.

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6 matching products · Select a product to see images and specifications.

UV Processing Equipment (5)

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1200 mm LED UV Curing Conveyor ZKLED-1200-300

UV Processing Equipment · ZKLED-1200-300

1200 mm LED UV Curing Conveyor

The ZKLED-1200-300 provides LED UV curing for touch-panel full-lamination and post-print processes across a 1200 mm curing width.

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For the documented printed-circuit processing stage; review the material and process settings.

For the documented printed-circuit processing stage; review the material and process settings.

PCB UV Curing Conveyor ZKUV-1204

UV Processing Equipment · ZKUV-1204

PCB UV Curing Conveyor

Conveyor UV curing equipment for printed PCBs, with a 1000 mm working width and four metal-halide lamps.

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For the documented printed-circuit processing stage; review the material and process settings.

Laminating & Cutting Equipment (1)

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Cuts patterned FPC rolls made from PI film and copper into sheets.

Materials & Processes

Explore equipment for UV drying after PCB printing, roll-to-roll exposure, nitrogen-oven processes used for PCB materials, and an FPC unloading step after SMT. This page does not represent a complete SMT production line; equipment selection must be confirmed against the exact process and workpiece.

Materials

  • PCB workpieces
  • FPC on aluminum carrier boards
  • Roll material for exposure

Process options

  • UV drying after PCB printing

  • Roll-to-roll exposure

  • Nitrogen baking

  • FPC unloading after SMT

Tell Us About Your Process

Send the following details to discuss equipment for PCB & SMT.

  • PCB or FPC workpiece details

    Provide material, dimensions, thickness and carrier or roll information.

  • Process target

    Provide the required UV, exposure or baking condition and acceptance method.

  • Capacity and integration

    Provide the target production rate, loading method and line interface requirements.

Process considerations
  • Workpiece dimensions and carrier format

    Confirm PCB or FPC dimensions and whether a carrier board or roll format is used.

  • Required process condition

    Confirm whether the project requires UV drying, exposure or nitrogen baking and provide the applicable process target.

  • Production and line interface

    Confirm production rate plus upstream and downstream equipment interfaces.

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